Functions and advantages the laser power can be continuously regulated
high precision and high speed
friendly man-machine contact surface which can show the cutting trace timing and the operated simply
non-touch processing resulted by very low rate of invalid chips
environmental protection and energy conservation Application scope

Product applicationCutting tinsel, solar cell board and sem iconductor silicon chips

Technical parametersLaser: YAG Infrared laser, or Green laser
Worktable: AUTO XY axis
Moving precision: 0.03mm
Line scribing/cutting speed: 10-100mm/s
Line scribing/cutting width: 0.03mm-0.1mm
Line scribing depth: 0.001mm-0.5mm
Min. Displacement: 0.01 mm
Electrical source: 220VAC±10% 50Hz

System components and environmental requirements Software :AHLASER software , Support WIN98/WIN2000/WINXP
Installation Environment :It occupies an area of 5 square meters and should by put steadily.
Working environment : smoothly in a clean environment without vibrating or dirt in the air because the dirt will make the mirror dirty and reduce its lift sharply.
Temperature of the environment: 25℃―28℃
Humidity of the environment: 5% to 75% (no condensation)
Power supply: 220VAC ±5% 50HZalternating current capacity, it should be more than 6KW, has null line and separate earth wire which should be connected with the earth well. The circuit breaker should be set specially for the machine (C32) and it should equip with electric leaking protecting device.

Samples